Georgia Tech-GEDC’s high-frequency lab includes four HP8510 vector network analyzers (one from 2-110 GHz), four RF probe stations (one cryogenic and one with a "hot" chuck for meas-urements under different temperature conditions), two load pull systems and several noise figure meters, spectrum analyzers, synthesizers and power meters. It also includes a small anechoic chamber for radiation pattern measurements. A wide variety of computers and workstations with full-wave simulation EM software such as HFSS, Sonnet and Momentum are also available. The Microelectronics Research Center (MiRC) includes a 9,000 sq.ft. clean room facility for micro- and nano-fabrication and characterization. The following is a list of some of the equipment located at MiRC: 1) CVC Electron beam evaporator, 2) CVC RF and DC sputterers, 3) CVC Filament evaporator, 4) Edwards Auto 306 sputterer, 5) Molecular Beam Epitaxy machine, 6) Karl Suss MJB-3 mask aligners (including IR capability), 7) Karl Suss MA-6 mask aligner, 8) Karl Suss spin coaters, 9) Rapid thermal annealer, 10) Lindberg furnaces, 11) Plasma therm ICP (deep RIE), 12) Plasma therm PECVD, 13) Plasma term RIE, 14) STS PECVD, 15) PlasMos ellipsometer, 16) Ozone stripper, 17) Alpha step profilometer, 18) Veeco Dektak profilometer, 19) Gold plating station, 20) Tousimis Critical point drier for MEMS release, 21) Hitachi 3500H SEM, 22) Semitool spin rinse drier, 23) Wet etching stations, 24) Automated dicing saw, 25) Polishing and lapping stations, 26) Dark room for mask generation, 27) Wire bonders (Au, Cu, Al), 28) Suss Microtech SB-6 wafer bonder, 29) High speed precision flip-chip placement, 30) K&S wire ball bump bonder.

For more information please visit: http://grover.mirc.gatech.edu.